PART |
Description |
Maker |
2-1102261-7 2-1102261-6 2-1102261-1 |
HOOD HB.10.STS1.16.G HOOD HB.10.STS.1.16.G
|
Tyco Electronics
|
2-1102606-5 |
Surface Mounted Housing Bottom Entry Anbaugehause HIP/HIP-K M6 Bg3
|
Tyco Electronics
|
XRT94L332 XRT94L33IB XRT94L33 |
3-CHANNEL DS3/E3/STS-1 TO STS-3/STM-1 MAPPER - SDH REGISTERS
|
EXAR[Exar Corporation]
|
XRT94L331 XRT94L33IB XRT94L33 |
3-CHANNEL DS3/E3/STS-1 TO STS-3/STM-1 MAPPER ATM/PPP - HARWARE MANUAL
|
EXAR[Exar Corporation]
|
XRT94L33IB XRT94L331 |
3-CHANNEL DS3/E3/STS-1 TO STS-3/STM-1 MAPPER ATM/PPP - HARWARE MANUAL
|
http://
|
XRT91L33IG-F XRT91L33IG XRT91L33 |
STS-12/STS-3 MULTIRATE CLOCK AND DATA RECOVERY UNIT
|
Exar Corporation
|
XRT94L3107 XRT94L31IB |
3-CHANNEL DS3/E3/STS-1 TO STS-3/STM-1 MAPPER IC
|
http://
|
WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE1 |
EEPROM MCP 128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp. White Electronic Designs, Corp.
|
XRT91L32IQ-F XRT91L32 |
STS-12/STM-4 OR STS-3/STM-1 SONET/SDH TRANSCEIVER
|
EXAR[Exar Corporation]
|
XRT91L31IQ XRT91L31 |
STS-12/STM-4 OR STS-3/STM-1 SONET/SDH TRANSCEIVER
|
EXAR[Exar Corporation]
|
2-1102656-5 |
Surface Mounted Housing Bottom Entry Anbaugehause HIP.16/40 AG
|
Tyco Electronics
|
0503247212 50324-7212 |
Spade Tongue Terminal for 10-12 AWG, Closed Uninsulated Brazed Barrel, Stud Size8 (M4), Oxygen-Free Copper, Length 18.20mm (.717"), Width 9.00mm (.354") Spade Tongue Terminal for 10-12 AWG, Closed Uninsulated Brazed Barrel, Stud Size8 (M4), Oxygen-Free Copper, Length 18.20mm (.717), Width 9.00mm (.354)
|
Molex Electronics Ltd.
|